- 品牌：
-
- CUI Devices (2)
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK DC/DC HA... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK BXB50,75,1... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
35,000
In-stock
|
提交询价 |
