- 品牌：
-
- Comair Rotron (1)
- CUI Devices (1)
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEAT SINK COPPER... |
1 |
28,112
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEAT SINK COPPER... |
1 |
57,361
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
1 |
3,510
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
10,500 |
35,000
In-stock
|
提交询价 | ||
|
Comair Rotron | HEATSINK STAMP 22... |
1 |
35,000
In-stock
|
提交询价 |
