- Attachment Method:
-
- Material:
-
- Material Finish:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,957
In-stock
|
提交询价 | |||
CUI Devices | HEATSINK TO-220 2.3W... |
1 |
129
In-stock
|
提交询价 | |||
CUI Devices | HEATSINK TO-220 2.3W... |
128 |
35,000
In-stock
|
提交询价 | |||
CUI Devices | HEATSINK TO-220 2.3W... |
3,000 |
35,000
In-stock
|
提交询价 |