- Attachment Method：
-
- Material：
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- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 9.8W... |
5,400 |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,500 |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 60 ... |
500 |
35,000
In-stock
|
提交询价 |
