- 品牌：
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- Aavid (13)
- Comair Rotron (3)
- CTS Corporation (2)
- CUI Devices (17)
- DFRobot (3)
- Enclustra (2)
- Sanyo Denki (5)
- Seeed (6)
- T-Global Technology (36)
- TechNexion (1)
- Trenz Electronic (3)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- 已选条件：
104 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | PH3N NANO 50.8X12.70X... |
1 |
298
In-stock
|
提交询价 | ||
|
|
Enclustra | ACC HEATSINK ME A... |
1 |
14
In-stock
|
提交询价 | ||
|
|
DFRobot | RASPBERRY PI COP... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Seeed | RASPBERRY PI COO... |
1 |
3
In-stock
|
提交询价 | ||
|
|
Trenz Electronic | HEATSPREADER FOR... |
1 |
3
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
54
In-stock
|
提交询价 | ||
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
33
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc. | HEAT SINK FOR TO2... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK TO-220 |
5,000 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK TO-221 |
5,000 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK FOR TO92 |
25,000 |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,000 |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
6,750 |
35,000
In-stock
|
提交询价 | ||
|
|
T-Global Technology | PH3N NANO 101.6X38.1X... |
1 |
9
In-stock
|
提交询价 | ||
|
|
Aavid | HEATSINK TO-202 CL... |
2,000 |
35,000
In-stock
|
提交询价 | ||
|
|
Aavid | HEATSINK TO-202 CL... |
2,000 |
35,000
In-stock
|
提交询价 | ||
|
|
Aavid | BOARD LEVEL HEAT... |
3,000 |
35,000
In-stock
|
提交询价 | ||
|
|
Aavid | BOARD LEVEL HEAT... |
2,000 |
35,000
In-stock
|
提交询价 | ||
|
|
Aavid | HEAT SINK |
1,000 |
35,000
In-stock
|
提交询价 |
