- 品牌：
-
- CTS Corporation (1)
- CUI Devices (3)
- DFRobot (2)
- Seeed (1)
- Attachment Method：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
9 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
2,000
In-stock
|
提交询价 | ||
|
|
Micro Connectors, Inc. | COOLING FAN/HS - R... |
1 |
500
In-stock
|
提交询价 | ||
|
|
DFRobot | PURE COPPER HEAT... |
1 |
45
In-stock
|
提交询价 | ||
|
|
DFRobot | RASPBERRY PI COP... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,000 |
35,000
In-stock
|
提交询价 | ||
|
|
Seeed | ACTIVE HEAT SINK... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK DPAK SM... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK PRESS O... |
1 |
35,000
In-stock
|
提交询价 |
