- 品牌：
-
- CUI Devices (3)
- Ohmite (4)
- Attachment Method：
-
- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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12 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Ohmite | EXTRUDED HEATSIN... |
1 |
656
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK TO-3 PWR... |
1 |
353
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK TO-3 HOR... |
1 |
323
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
3,230
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,118
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
999
In-stock
|
提交询价 | ||
|
|
Ohmite | EXTRUDED HEATSIN... |
1 |
142
In-stock
|
提交询价 | ||
|
|
Ohmite | EXTRUDED HEATSIN... |
1,200 |
35,000
In-stock
|
提交询价 | ||
|
Ohmite | EXTRUDED HEATSIN... |
1,120 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 DU... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK FOR MET... |
1 |
35,000
In-stock
|
提交询价 |
