- 品牌：
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- CUI Devices (2)
- Attachment Method：
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- Material：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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6 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1 |
104
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,542
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,572
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1 |
74
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X12.5M... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
4
In-stock
|
提交询价 |
