- 品牌:
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- CTS Corporation (5)
- CUI Devices (1)
- Attachment Method:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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17 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
CTS Corporation | HEATSINK FORGED ... |
1 |
12,290
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 29X12MM S... |
1 |
118
In-stock
|
提交询价 | |||
CUI Devices | HEAT SINK, BGA, 33.... |
1 |
1,194
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 21X18MM F... |
1 |
98
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 21X18MM S... |
1 |
99
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 21X18MM D... |
1 |
97
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 29X12MM F... |
1 |
85
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 29X12MM D... |
1 |
88
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X19.5M... |
10 |
35,000
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEATSINK 31X31X19.5M... |
10 |
35,000
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
100 |
35,000
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
1 |
1
In-stock
|
提交询价 | |||
Wakefield Thermal | HEAT SINK ELLIP F... |
270 |
35,000
In-stock
|
提交询价 | |||
CTS Corporation | HEATSINK FORGED ... |
1 |
35,000
In-stock
|
提交询价 | |||
CTS Corporation | HEATSINK FORGED ... |
1 |
35,000
In-stock
|
提交询价 | |||
CTS Corporation | HEATSINK FORGED ... |
1 |
35,000
In-stock
|
提交询价 | |||
CTS Corporation | HEATSINK FORGED ... |
1 |
35,000
In-stock
|
提交询价 |