- 品牌：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Material Finish：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 33MM X 33... |
1 |
265
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
1 |
100
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 32.5 X 32.5... |
1 |
76
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 33MM X 33... |
1 |
75
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 32.5 X 32.5... |
1 |
96
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
84
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
100
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
95
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 31X23MM S... |
1 |
88
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 31X23MM F... |
1 |
56
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
35,000
In-stock
|
提交询价 | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 37.5X37.5X2... |
10 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 32.5X32.5X1... |
10 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 33X33X17.5M... |
10 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
100 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 32.5 X 32.5... |
1 |
16
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 31X23MM D... |
400 |
35,000
In-stock
|
提交询价 |
