- 品牌:
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- CTS Corporation (2)
- CUI Devices (2)
- Attachment Method:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Shape:
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- Thermal Resistance @ Natural:
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22 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
Wakefield Thermal | HEATSINK 40X40X12MM... |
1 |
772
In-stock
|
提交询价 | |||
CUI Devices | HEAT SINK, BGA, 43.... |
1 |
1,081
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45... |
1 |
897
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 45MM X 45... |
1 |
54
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 45MM X 45... |
1 |
32
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
54
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45... |
1 |
72
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 23X33MM F... |
1 |
53
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 23X33MM S... |
1 |
50
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 29X23MM S... |
1 |
98
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 29X23MM D... |
1 |
66
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 29X23MM F... |
1 |
44
In-stock
|
提交询价 | |||
CUI Devices | HEAT SINK, BGA, 45 ... |
1 |
35,000
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEATSINK 45X45X19.5M... |
10 |
35,000
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK MULTIWA... |
600 |
35,000
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK TO-220 W/P... |
600 |
35,000
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 23X33MM D... |
400 |
35,000
In-stock
|
提交询价 | |||
CTS Corporation | HEATSINK FORGED ... |
1 |
35,000
In-stock
|
提交询价 | |||
CTS Corporation | HEATSINK FORGED ... |
1 |
35,000
In-stock
|
提交询价 | |||
TE Connectivity AMP Connectors | 42.5MM HS ASSY ULTE... |
1 |
35,000
In-stock
|
提交询价 |