- 品牌:
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- CTS Corporation (3)
- CUI Devices (1)
- Attachment Method:
-
- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, EXTRUS... |
1,200 |
35,000
In-stock
|
提交询价 | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
35,000
In-stock
|
提交询价 | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
35,000
In-stock
|
提交询价 | |||
CTS Corporation | HEATSINK FORGED ... |
300 |
35,000
In-stock
|
提交询价 | |||
Wakefield Thermal | HEAT SINK PIN FIN... |
180 |
35,000
In-stock
|
提交询价 |