- 品牌：
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- CUI Devices (1)
- Attachment Method：
-
- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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12 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,262
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X23MM F... |
1 |
247
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1 |
45
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X23MM D... |
1 |
75
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 27X18MM S... |
1 |
86
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 27X18MM F... |
1 |
76
In-stock
|
提交询价 | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X24.5M... |
10 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1,200 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1,200 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1,200 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X23MM S... |
400 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 27X18MM D... |
1 |
17
In-stock
|
提交询价 |
