- 品牌：
-
- CUI Devices (1)
- Attachment Method：
-
- Material：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
6 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
1 |
86
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X21MM S... |
1 |
90
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X21MM D... |
1 |
87
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
35,000
In-stock
|
提交询价 | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 37.5X37.5X1... |
10 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X21MM F... |
400 |
35,000
In-stock
|
提交询价 |
