- 品牌：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Natural：
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- Type：
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9 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45... |
1 |
901
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
1 |
86
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45... |
1 |
68
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X21MM S... |
1 |
90
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X21MM D... |
1 |
87
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
35,000
In-stock
|
提交询价 | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 37.5X37.5X1... |
10 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X21MM F... |
400 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 |
1 |
35,000
In-stock
|
提交询价 |
