- 品牌：
-
- CTS Corporation (1)
- CUI Devices (1)
- Attachment Method：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
6 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
1 |
152
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X24.5M... |
1 |
100
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
524
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 42.5 X 42.5... |
1 |
65
In-stock
|
提交询价 | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 42.5X42.5X1... |
10 |
35,000
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEAT SINK FORGED... |
300 |
35,000
In-stock
|
提交询价 |
