- 品牌：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Natural：
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13 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 27X27X12MM... |
1 |
97
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,606
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1 |
59
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 19X23MM F... |
1 |
84
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 58MM X 30... |
1 |
66
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 58MM X 30... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 19X23MM S... |
1 |
24
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X19.5M... |
1 |
200
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1 |
5
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 19X23MM D... |
400 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 DU... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK BRIDGE ... |
1 |
35,000
In-stock
|
提交询价 |
