- 品牌：
-
- Cooling Source (1)
- CUI Devices (1)
- Attachment Method：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Type：
-
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Cooling Source | 25X25 X20MM |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
55 |
35,000
In-stock
|
提交询价 | ||
|
Wakefield Thermal | HEAT SINK PIN FIN... |
270 |
35,000
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | 2 FINS, 2.00 OD HS W/... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | 2 FINS, 2.000 OD HS W... |
1 |
35,000
In-stock
|
提交询价 |
