- 品牌：
-
- CUI Devices (1)
- Attachment Method：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
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- Thermal Resistance @ Natural：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220/TO... |
1 |
630
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,500 |
35,000
In-stock
|
提交询价 | ||
|
Wakefield Thermal | HEAT SINK ELLIP F... |
270 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
270 |
35,000
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | HEAT SINK BGA 37.5M... |
1 |
8
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220/TO... |
1 |
35,000
In-stock
|
提交询价 |
