- 品牌：
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- CUI Devices (1)
- Attachment Method：
-
- Material：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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7 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
5,589
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 19X15MM F... |
1 |
225
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 19X15MM S... |
1 |
89
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 19X15MM D... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X12MM F... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X12MM D... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X12MM S... |
400 |
35,000
In-stock
|
提交询价 |
