- 品牌：
-
- CTS Corporation (1)
- CUI Devices (2)
- Attachment Method：
-
- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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6 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1 |
275
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,215
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
3,230
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1 |
95
In-stock
|
提交询价 | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X14.5M... |
10 |
35,000
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEAT SINK FORGED... |
300 |
35,000
In-stock
|
提交询价 |
