- 品牌：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Shape：
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- Thermal Resistance @ Natural：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK FOR TO22... |
1 |
21,619
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
1,713
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.6MM X ... |
1 |
187
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 21MM X 21... |
1 |
676
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1 |
39
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
87
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 21MM X 21... |
1 |
3
In-stock
|
提交询价 | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 21X21X19.5M... |
10 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X14.5M... |
10 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X19.5M... |
10 |
35,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
100 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK FOR TO22... |
5,600 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK VERT MT... |
5,600 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK TO-220 VE... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | 27MM HS ASSY ULTEM... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | 27MM LOW P HS ASSY... |
3 |
35,000
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | 31MM HS ASSY ULTEM... |
1 |
35,000
In-stock
|
提交询价 |
