Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
图片 型号 品牌 描述 起订量 库存 操作
HSB10-232306 CUI Devices
HEAT SINK, BGA, 23 ...
1
1,287
In-stock
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HSB03-121218 CUI Devices
HEAT SINK, BGA, 12 ...
1
1,689
In-stock
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