- 品牌：
-
- CUI Devices (1)
- Attachment Method：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Type：
-
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-218/TO... |
1 |
1,341
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
1 |
859
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
3,000 |
35,000
In-stock
|
提交询价 |
