- 品牌：
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- CUI Devices (1)
- Attachment Method：
-
- Material：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,355
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 |
1 |
683
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1 |
301
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 AL... |
1 |
822
In-stock
|
提交询价 |
