- 品牌：
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- CUI Devices (1)
- Attachment Method：
-
- Material：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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3 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
700
In-stock
|
提交询价 | ||
|
TE Connectivity AMP Connectors | 40MM HS ASSY ULTEM... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | 42.5MM HS ASSY ULTE... |
1 |
35,000
In-stock
|
提交询价 |
