- 品牌：
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- CUI Devices (1)
- Malico Inc. (1)
- Attachment Method：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,992
In-stock
|
提交询价 | ||
|
Malico Inc. | AL HEAT SINK 27X27X... |
1 |
35,000
In-stock
|
提交询价 |
