- 品牌：
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- CUI Devices (1)
- Ohmite (1)
- Attachment Method：
-
- Material：
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- Package Cooled：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Type：
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6 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
167
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 21X21X23MM... |
270 |
35,000
In-stock
|
提交询价 | ||
|
Wakefield Thermal | HEAT SINK ELLIP F... |
270 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
270 |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | 30.5MM LOW P HS ASS... |
1 |
35,000
In-stock
|
提交询价 |
