- 品牌：
-
- CTS Corporation (1)
- CUI Devices (1)
- Ohmite (1)
- Attachment Method：
-
- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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10 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
1 |
9
In-stock
|
提交询价 | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
10
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Ohmite | HEATSINK BLACK A... |
5,600 |
35,000
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEAT SINK FORGED... |
300 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
270 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
270 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
270 |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
270 |
35,000
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | HS ASSY CLIP |
1 |
35,000
In-stock
|
提交询价 |
