- 品牌：
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- CUI Devices (3)
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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13 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
121
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
107
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
332
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,957
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
646
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
46
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
58
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
32
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
100
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
80
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
71
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
35,000
In-stock
|
提交询价 | ||
|
Wakefield Thermal | HEATSINK FOR TO92 |
25,000 |
35,000
In-stock
|
提交询价 |
