- 品牌：
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- CUI Devices (10)
- T-Global Technology (10)
- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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28 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 |
4,888
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
1 |
3,510
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 |
118,038
In-stock
|
提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
104
In-stock
|
提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
394
In-stock
|
提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
174
In-stock
|
提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
89
In-stock
|
提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
49
In-stock
|
提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
26
In-stock
|
提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
85
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1 |
71
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1 |
301
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
150 |
300
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
1 |
129
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
283
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
376
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR TO22... |
1 |
240
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR PLA... |
1 |
74
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc. | HEAT SINK |
1 |
32
In-stock
|
提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
35,000
In-stock
|
提交询价 |
