- 品牌：
-
- CUI Devices (3)
- Seeed (1)
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
7 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 |
4,888
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
1 |
3,510
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 |
118,038
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
150 |
300
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
10,500 |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
9,000 |
35,000
In-stock
|
提交询价 | ||
|
|
Seeed | RASPERRY PI COPP... |
1 |
35,000
In-stock
|
提交询价 |
