- 品牌：
-
- CUI Devices (27)
- Wakefield Thermal (13)
- Material：
-
- Material Finish：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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40 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
3,205
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
1 |
3,326
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,287
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
1,713
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
1,689
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
5,589
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
1,433
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
1,250
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
1,090
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X... |
1 |
1,358
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.... |
1 |
1,194
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,202
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 43.... |
1 |
1,081
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
1 |
780
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
700
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
239
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | 1.75WX12" EXTRUS 16249... |
1 |
36
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | 1.66" WIDE X 12" BGA H... |
1 |
36
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | 1.1WX12" EXTRUSI 1624... |
1 |
87
In-stock
|
提交询价 |
