Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
图片 型号 品牌 描述 起订量 库存 操作
HSB16-404018 CUI Devices
HEAT SINK, BGA, 40 ...
1
1,250
In-stock
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HSB22-606010 CUI Devices
HEAT SINK, BGA, 60 ...
500
35,000
In-stock
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