- 品牌：
-
- CTS Corporation (229)
- CUI Devices (2)
- Ohmite (10)
- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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249 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
221
In-stock
|
提交询价 | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
150
In-stock
|
提交询价 | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
167
In-stock
|
提交询价 | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
520
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,582
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,572
In-stock
|
提交询价 | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
98
In-stock
|
提交询价 | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
42
In-stock
|
提交询价 | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
46
In-stock
|
提交询价 | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
27
In-stock
|
提交询价 | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
2
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
528 |
35,000
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
1,092 |
35,000
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
528 |
35,000
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
606 |
35,000
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
606 |
35,000
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
480 |
35,000
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
528 |
35,000
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
480 |
35,000
In-stock
|
提交询价 |
