- 品牌：
-
- Aavid (1)
- CTS Corporation (229)
- CUI Devices (120)
- iWave Systems (3)
- Malico Inc. (21)
- Ohmite (58)
- Seeed (3)
- Wakefield Thermal (91)
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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596 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1 |
53,181
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
15,288
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1 |
2,598
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1 |
4,077
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
3,205
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1 |
2,403
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1 |
5,602
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
1 |
3,326
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1 |
4,287
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,287
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
1,713
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1 |
1,280
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,893
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
1,689
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
5,589
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1 |
1,956
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1 |
422
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
2,208
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,944
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
1,433
In-stock
|
提交询价 |
