- 品牌:
-
- Aavid (5)
- Comair Rotron (8)
- Cooling Source (7)
- DFRobot (2)
- Seeed (2)
- T-Global Technology (23)
- Attachment Method:
-
- Material Finish:
-
- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Thermal Resistance @ Forced Air Flow:
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57 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
Aavid | BOARD LEVEL HEAT... |
1 |
5,107
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | DUALFLOW HEATSIN... |
1 |
31
In-stock
|
提交询价 | |||
Aavid | THM,10594B-TT REV BB... |
1 |
593
In-stock
|
提交询价 | |||
OSEPP Electronics | RASPBERRY PI COP... |
2 |
205
In-stock
|
提交询价 | |||
DFRobot | PURE COPPER HEAT... |
1 |
45
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | CPU HEAT SINK NO ... |
1 |
2
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | CPU HEAT SINK NO ... |
1 |
15
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | QUADFLOW HEATSIN... |
1 |
18
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | DUALFLOW HEATSIN... |
1 |
15
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | QUADFLOW HEATSIN... |
1 |
15
In-stock
|
提交询价 | |||
T-Global Technology | PH3N NANO 50.8X12.70X... |
1 |
298
In-stock
|
提交询价 | |||
Aavid | INTEL XEON CPU CO... |
1 |
12
In-stock
|
提交询价 | |||
DFRobot | RASPBERRY PI COP... |
1 |
35,000
In-stock
|
提交询价 | |||
Aavid | INTEL XEON CPU CO... |
1 |
35,000
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK |
3,000 |
35,000
In-stock
|
提交询价 | |||
T-Global Technology | PH3N NANO 101.6X38.1X... |
1 |
9
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK FOR TO22... |
800 |
35,000
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK TO-220 PW... |
5,000 |
35,000
In-stock
|
提交询价 | |||
Aavid | BOARD LEVEL HEAT... |
1,000 |
35,000
In-stock
|
提交询价 | |||
Seeed | EXTREME COOLING ... |
20 |
35,000
In-stock
|
提交询价 |