- 品牌:
-
- Comair Rotron (1)
- CUI Devices (2)
- Ohmite (1)
- Attachment Method:
-
- Material:
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- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Shape:
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- Thermal Resistance @ Natural:
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20 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
1 |
576
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1 |
960
In-stock
|
提交询价 | |||
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
1,433
In-stock
|
提交询价 | |||
Ohmite | BGA HEATSINK W/TA... |
1 |
221
In-stock
|
提交询价 | |||
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
239
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 45MM X 45... |
1 |
90
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 33MM X 33... |
1 |
27
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1 |
52
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 28MM X 45... |
1 |
94
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 23X18MM F... |
1 |
81
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 23X18MM D... |
1 |
69
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 27X15MM D... |
400 |
35,000
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 27X15MM S... |
1 |
65
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEATSINK 45X45X14.5M... |
10 |
35,000
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEATSINK 33X33X19.5M... |
10 |
35,000
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X24.5M... |
10 |
35,000
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 23X18MM S... |
400 |
35,000
In-stock
|
提交询价 | |||
Wakefield Thermal | HEATSINK 27X15MM F... |
400 |
35,000
In-stock
|
提交询价 | |||
Advanced Thermal Solutions, Inc. | HEATSINK 12-SIP W/... |
1 |
35,000
In-stock
|
提交询价 | |||
Comair Rotron | HEATSINK STAMP 12... |
1 |
35,000
In-stock
|
提交询价 |