- 品牌：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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6 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,893
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 21X12MM S... |
1 |
444
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 21X12MM F... |
1 |
66
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 30... |
1 |
3
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 30... |
1 |
23
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 21X12MM D... |
1 |
5
In-stock
|
提交询价 |
