- 品牌：
-
- Ohmite (2)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK AND CLI... |
1 |
426
In-stock
|
提交询价 | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
779
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
1 |
53
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
85
In-stock
|
提交询价 | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
12
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
5
In-stock
|
提交询价 |
