- Attachment Method：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
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- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
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- 已选条件：
173 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.7W... |
1 |
1,923
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
15,288
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 6.8W... |
1 |
1,393
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
3,205
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
1 |
3,326
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,287
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
1,713
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,893
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
1,689
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
5,589
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
2,208
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,944
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
1,433
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,262
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
1,250
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
1,774
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
1 |
2,121
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
2,000
In-stock
|
提交询价 |
