- 品牌：
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- Backing, Carrier：
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- Outline：
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- Shape：
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- Thermal Conductivity：
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- Thermal Resistivity：
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- 已选条件：
8 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Bergquist / Henkel | THERM PAD 19.05MMX1... |
1 |
1,710
In-stock
|
提交询价 | ||
|
|
Bergquist / Henkel | THERM PAD 17.45MMX1... |
1 |
7,022
In-stock
|
提交询价 | ||
|
|
Bergquist / Henkel | THERM PAD 19.05MMX1... |
1 |
93,784
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc. | THERMAL INTERFAC... |
1 |
911
In-stock
|
提交询价 | ||
|
|
Bergquist / Henkel | THERM PAD 19.05MMX1... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Bergquist / Henkel | Q3 2.2X0.85X0.005 CUSTO... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Bergquist / Henkel | ACCESS FOIL FORM... |
1 |
35,000
In-stock
|
提交询价 | ||
|
|
Bergquist / Henkel | THERM PAD 19.05MMX1... |
1 |
35,000
In-stock
|
提交询价 |
