- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
9 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
3,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
2,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,987
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,355
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,657
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
2,577
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
2,713
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,992
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1,000 |
35,000
In-stock
|
Get Quote |