Manufacturer:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Image Part Manufacturer Description MOQ Stock Action
271-AB Wakefield Thermal
HEATSINK TO-220 TO...
1
6,335
In-stock
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HSS13-B20-NP CUI Devices
HEAT SINK, STAMPI...
1
646
In-stock
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