- Manufacturer：
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- CUI Devices (1)
- Ohmite (1)
- Attachment Method：
-
- Material：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
35,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK BLACK A... |
5,600 |
35,000
In-stock
|
Get Quote |
