- Manufacturer:
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- CUI Devices (2)
- Attachment Method:
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- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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11 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
2,938
In-stock
|
Get Quote | ||
|
ASSMANN WSW Components | HEATSINK ANOD AL... |
1 |
989
In-stock
|
Get Quote | ||
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
250
In-stock
|
Get Quote | ||
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
102
In-stock
|
Get Quote | ||
|
ASSMANN WSW Components | HEAT SINK ANOD AL... |
1 |
1,363
In-stock
|
Get Quote | ||
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
90
In-stock
|
Get Quote | ||
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
89
In-stock
|
Get Quote | ||
|
NTE Electronics, Inc. | HEATSINK FOR TO22... |
1 |
240
In-stock
|
Get Quote | ||
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
32
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 3.6W... |
4,000 |
35,000
In-stock
|
Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4.4W... |
3,000 |
35,000
In-stock
|
Get Quote |