- Attachment Method：
-
- Material：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 9.8W... |
5,400 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,500 |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 60 ... |
500 |
35,000
In-stock
|
Get Quote |
