Attachment Method:
Material Finish:
Package Cooled:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE-B2111-038 CUI Devices
HEAT SINK, EXTRUS...
1
15,288
In-stock
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HSS-C2540-SMT-TR CUI Devices
HEAT SINK TO-263 CO...
150
300
In-stock
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