Attachment Method:
Material Finish:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE06-503045 CUI Devices
HEAT SINK, EXTRUS...
1
1,197
In-stock
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HSE07-753045 CUI Devices
HEAT SINK, EXTRUS...
1
992
In-stock
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ATS-EXL119-1220-R0 Advanced Thermal Solutions, Inc.
PCIE EXTRUSION P...
1
4
In-stock
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ATS-EXL119-300-R0 Advanced Thermal Solutions, Inc.
PCIE EXTRUSION P...
1
2
In-stock
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