- Manufacturer:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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3 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 W/T... |
1 |
786
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK MULTIWA... |
1,050 |
35,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK MULTIWA... |
600 |
35,000
In-stock
|
Get Quote |